Ua ʻike au i kahi hōʻike i ka wā lōʻihi i hala aku nei: ua hoʻohana nā ʻepekema mai Kelemania, Iapana a me nā ʻāina ʻē aʻe i 5 mau makahiki a ua hoʻolimalima kokoke i 10 miliona yuan e hana i kahi pōpō i hana ʻia me nā mea silicon-28 kiʻekiʻe. ʻO kēia 1kg maʻemaʻe silicon pōpō e koi ana i ka Ultra-precision machining, wili a me ka polishing, ke ana pololei (sphericity, roughness a me ka maikaʻi), hiki ke ʻōlelo ʻia ʻo ia ka pōʻai pōʻai ma ka honua.
E hoʻolauna kākou i ke kaʻina hana polishing ultra-precision.
01 ʻO ka ʻokoʻa ma waena o ka wili a me ka polishing
Ka wili ʻana: Me ka hoʻohana ʻana i nā ʻāpana abrasive i uhi ʻia a kaomi ʻia paha i ka mea wili, hoʻopau ʻia ka ʻili e ka neʻe ʻana o ka mea wili a me ka mea hana ma lalo o kekahi kaomi. Hiki ke hoʻohana ʻia ka wili no ka hana ʻana i nā mea metala a me nā mea metala ʻole. ʻO ke ʻano o ka ʻili i hoʻoponopono ʻia, ʻo ia ka mokulele, loko a me waho o ka cylindrical a me ka conical surfaces, convex a me concave spherical surfaces, threads, tooth surfaces a me nā mea ʻē aʻe. Hiki i ka pololei o ka hana ke hiki i IT5 ~ IT1, a hiki i ka roughness o ka ʻili ke hiki i Ra0.63 ~ 0.01μm.
Polishing: He ʻano hana e hoʻemi ai i ka ʻeleʻele o ka ʻili o ka mea hana ma o ka hana mechanical, kemika a i ʻole ka electrochemical e loaʻa ai kahi ʻālohilohi a maʻalahi.
ʻO ka ʻokoʻa nui ma waena o nā mea ʻelua, ʻoi aku ka kiʻekiʻe o ka hoʻopau ʻana ma ka polishing ma mua o ka wili ʻana, a hiki ke hoʻohana ʻia nā ʻano kemika a i ʻole electrochemical, ʻoiai ke hoʻohana wale nei ka wili ʻana i nā ʻano mechanical, a ʻoi aku ka nui o ka nui o ka palaoa abrasive ma mua o ka mea i hoʻohana ʻia. poni ana. ʻO ia hoʻi, nui ka nui o ka ʻāpana.
02 ʻenehana hoʻoliʻiliʻi pololei loa
ʻO ka hoʻoliʻi ultra-precision ka ʻuhane o ka ʻoihana uila hou
ʻO ka mikiona o ka ʻenehana polishing ultra-precision i loko o ka ʻoihana uila hou ʻaʻole wale e hoʻopalapala i nā mea like ʻole, akā e hoʻopalapala i nā mea ʻāpana multi-layer, i hiki i nā wafers silicon o kahi mau millimeters square ke hana i nā ʻumi kaukani a VLSI i haku ʻia he mau miliona. nā transistors. No ka laʻana, ua hoʻololi ke kamepiula i hana ʻia e nā kānaka mai ka ʻumi o nā tona a i nā haneli haneli i kēia mau lā, ʻaʻole hiki ke ʻike ʻia me ka ʻole o ka ultra-precision polishing.
ʻO ka lawe ʻana i ka hana wafer ma ke ʻano he laʻana, ʻo ka polishing ka hana hope loa o ke kaʻina holoʻokoʻa, ʻo ke kumu ka hoʻomaikaʻi ʻana i nā hemahema liʻiliʻi i waiho ʻia e ke kaʻina hana wafer mua e loaʻa ai ka parallelism maikaʻi loa. Pono ka pae ʻoihana ʻike optoelectronic o kēia lā i nā koi parallelism pololei loa no nā mea substrate optoelectronic e like me ka sapphire a me ka silika aniani hoʻokahi, i hiki i ka pae nanometer. ʻO kēia ke ʻano o ke kaʻina hana polishing ua komo pū i ka pae ultra-precision o nanometers.
ʻO ke koʻikoʻi o ke kaʻina hana polishing ultra-precision i ka hana hou ʻana, hiki i kāna mau kahua noi ke wehewehe pololei i ka pilikia, me ka hana ʻana o ka circuit circuit, nā mea lapaʻau, nā ʻāpana kaʻa, nā lako kikohoʻe, nā mold precision a me ka aerospace.
ʻO ka ʻenehana polishing kiʻekiʻe i haku ʻia e kekahi mau ʻāina e like me ʻAmelika a me Iapana
ʻO ka mea nui o ka mīkini polishing ka "wili disc". ʻO ka ultra-precision polishing he mea koʻikoʻi koʻikoʻi i ka haku mele a me nā koi ʻenehana o ka disc wili i ka mīkini polishing. ʻAʻole pono kēia ʻano diski kila i hoʻohui ʻia mai nā mea kūikawā wale nō i ka nano-level precision o ka hana ʻakomi, akā loaʻa pū kekahi me ka hoʻonui ʻana i ka wela.
Ke holo nei ka mīkini polishing i ka wikiwiki, inā hoʻonui ka wela i ka deformation thermal o ka disc grinding, ʻaʻole hiki ke hōʻoia i ka palahalaha a me ka like o ka substrate. A ʻo kēia ʻano hewa deformation thermal ʻaʻole hiki ke ʻae ʻia e hana ʻaʻole he mau millimeters a i ʻole kekahi mau microns, akā he mau nanometer.
I kēia manawa, hiki i nā kaʻina hana polishing honua kiʻekiʻe e like me ʻAmelika Hui Pū ʻIa a me Iapana ke hoʻokō i nā koi polishing precision o 60-inch substrate raw material (he nui ka nui). Ma muli o kēia, ua ʻike lākou i ka ʻenehana koʻikoʻi o nā kaʻina hana polishing ultra-precision a paʻa paʻa i ka hana i ka mākeke honua. . ʻO ka ʻoiaʻiʻo, ʻo ka haku ʻana i kēia ʻenehana e hoʻomalu i ka hoʻomohala ʻana o ka ʻoihana hana uila i kahi nui.
Ke alo nei me kahi poloka ʻenehana koʻikoʻi, ma ke kahua o ka ultra-precision polishing, hiki i koʻu ʻāina ke hana i ka noiʻi pilikino i kēia manawa.
He aha ke kiʻekiʻe o ka ʻenehana polishing ultra-precision o Kina?
ʻO ka ʻoiaʻiʻo, ma ke kahua o ka ultra-precision polishing, ʻaʻole ʻo Kina me ka ʻole o nā hoʻokō.
I ka makahiki 2011, ua lanakila ka "Cerium Oxide Microsphere Particle Size Standard Material and It Preparation Technology" e ka hui o Dr. Wang Qi mai ka National Center for Nanoscale Sciences o ka Chinese Academy of Sciences i lanakila i ka makana mua o ka China Petroleum and Chemical Industry. ʻO ka Federation's Technology Invention Award, a me ka nanoscale particle size standard material Loaʻa i ka laikini mea ana ʻāina a me ka palapala hōʻoia waiwai maʻamau papa mua. ʻO ka hopena hoʻokolohua ultra-precision polishing production o ka mea cerium oxide hou i ʻoi aku ma mua o nā mea kuʻuna haole i ka hāʻule hoʻokahi, e hoʻopiha ana i ka hakahaka ma kēia kahua.
Akā, ʻōlelo ʻo Kauka Wang Qi: “ʻAʻole kēia manaʻo ua piʻi mākou i luna o kēia kahua. No ke kaʻina holoʻokoʻa, aia wale nō ka wai polishing akā ʻaʻohe mīkini polishing ultra-precision. ʻO ka hapa nui, ke kūʻai aku nei mākou i nā mea waiwai. "
I ka makahiki 2019, ua hoʻokumu ka hui noiʻi o Profesor Yuan Julong o Zhejiang University of Technology i ka ʻenehana hoʻoheheʻe ʻenehana semi-fixed abrasive. ʻO ke ʻano o nā mīkini polishing i hoʻomohala ʻia ua hana nui ʻia e Yuhuan CNC Machine Tool Co., Ltd., a ua ʻike ʻia ʻo iPhone4 a me iPad3 aniani e Apple. ʻO nā mea hoʻoliʻiliʻi pololei wale nō o ka honua no ka panel a me ka alumini alumini backplane polishing, ʻoi aku ma mua o 1,700 mau mīkini polishing i hoʻohana ʻia no ka hana nui ʻana o nā papa aniani o Apple iPhone a me iPad.
ʻO ka nani o ka hana mechanical aia i kēia. I mea e alualu ai i ka māhele makeke a me ka loaʻa kālā, pono ʻoe e hoʻāʻo i kāu mea maikaʻi loa e hopu i nā poʻe ʻē aʻe, a e hoʻomaikaʻi mau a hoʻomaikaʻi ka alakaʻi ʻenehana, e hoʻomaʻemaʻe ʻia, e hoʻokūkū mau a hopu, a e paipai i ka hoʻomohala nui o ʻenehana kanaka.
Ka manawa hoʻouna: Mar-08-2023
